회원사소식
[2011] Flip Chip Packaging Technologies
- 작성일2011/12/20 11:26
- 조회 1,289
- Date: Dec.20. 2011
- Venue: koreacircuit / Dae Duck Aperio
- Note : Flip Chip Packaging Technologies
1. Overall packaging trend
2. Current issue
3. Future direction
4. Flip chip history
5. Joint technology
6. Substrate technology
7. Package relability