회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

Northeast Asia Standization Cooperation Forum WG7
  • 작성일2012/06/19 13:52
  • 조회 1,482
 - Date : Jun. 12. 2012
 
 - Venue : 2F, East Exhibition Hall 6, Big Sight, Toyko, Japan
 
 - participants :
 
China     Mr. Kevin Yan, CPCA
              Mr. Wu Lei, Shennan Circuit Co., Ltd.
              Ms. Yang Yan, Shengyi Technology Co., Ltd.
Japan    Mr. Kunio Takahara, JPCA
              Mr. Hiroaki Fujiwara, JPCA
              Ms. Nanako Okabe, JPCA
Korea     Mr. Hyunkun Kim, TechniCom
              Dr. Hyunho Kim, Samsung Electro Mechanics
              Ms. Kyounghee Lee, KPCA