회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

    Northeast Asia Standization Cooperation Forum WG7
    • 작성일2012/06/19 13:52
    • 조회 1,382
     - Date : Jun. 12. 2012
     
     - Venue : 2F, East Exhibition Hall 6, Big Sight, Toyko, Japan
     
     - participants :
     
    China     Mr. Kevin Yan, CPCA
                  Mr. Wu Lei, Shennan Circuit Co., Ltd.
                  Ms. Yang Yan, Shengyi Technology Co., Ltd.
    Japan    Mr. Kunio Takahara, JPCA
                  Mr. Hiroaki Fujiwara, JPCA
                  Ms. Nanako Okabe, JPCA
    Korea     Mr. Hyunkun Kim, TechniCom
                  Dr. Hyunho Kim, Samsung Electro Mechanics
                  Ms. Kyounghee Lee, KPCA