S9 Printed Electronics

Chair: Chris Jorgenson, IPC

  S10 Testing/Reliability 2

Chair: David Bergman, IPC

FOWLP Forum (13:00~15:00)

Chair: Kevin Yan, CPCA

13:00~13:30

PEO-1 Laser Sintering of Cu Based Metal-Organic Decomposition Ink for Printed Electronics Application
Kyung-Tae Kang, Korea Inst. of Industrial Tech.

RLO-21 Investigation on FR408HR Materials Inner Connect Reliability
Lipeng Wan, Shengyi Electronic Co., Ltd.

Fan out Package innovations

for future

Benson Lin, MediaTek

13:30~14:00

PEO-2  Calixarene as additive

fixing agent  research on PCB

production
Zhenquan Liu, Guangdong Chengde Elec.Tech Co., Ltd.

RLO-22 Acceleration Test of Ion Migration in FR-4 Laminates
Hyekyoung Lee, Doosan Corp. Electro-Materials BG.

Updated FOWLP development

Shuzo.Akejima, Toshiba

14:00~14:30

PEO-3 Thermal Sintering of Inkjet-printed Silver

Patterns by a Heated Gas Beam
Sang-Ho Lee, Korea Inst. of Industrial Tech.

RLO-23 PCB Reliability problem on CAF and Pseudo CAF

Jinho Lee, Korea Electronics Technology Institute