Room 305

Room 306

Room 307

  S14 Packaging/PCB Materials 3

Chair: CHUN-LAI, CHANG,

Dupont Taiwan Limited

 S15 Process Technology 3

Chair: Tim Lee, KPCA

 PCB/Packaging Technology FORUM

Chair: Hirofumi Matsumoto

NipponMektron

10:00~10:30

MAO-31 Conformal Coatings Today and in the Future

Manfred Suppa, Lackwerke Peters GmbH & Co. KG

PTO-31 The equipment for ultra thin board treatment
Kazuyoshi Nishimoto, C. Uyemura & Co., Ltd.

FPC Market and related Technology Trend

Hirofumi Matsumoto, Nippon Mektron

10:30~11:00

MAO-32 Technology trends in flexible circuits materials for smart phone application

Jeongmin Kweon, INNOX Corporation

PTO-32 Research on Printed Circuit Board Mechanical

Drilling
Chengyong Wang, Guangdong University of Technology

11:00~11:30

MAO-33 Development of Electric Insulating and Non-Cleaning Sn-3.0Ag-0.5Cu Solder Paste

Ashutosh Sharma, University of Seoul

PTO-33 Patent application trend in PCB Field
Byungjo Min, Korean Intellectual Property Office

Latest Trends on Heterogeneous

Integration

Henry Utsunomiya, Interconnection

Technologies

11:30~12:00

MAO-34 Development of Super Adhesion Primer for Fine Pattern
HyeonJin Seo, Doosan Corp. Electro-Materials BG