회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

    [KPCA] 2007 Korea-Japan Joint Symposium
    • 작성일2007/09/06 11:46
    • 조회 1,783
    - Date : September 6, 2007 - Venue : Seoul, Sahak Pension Bldg. (Seminar Room 2nd Fl.) - Note : 1) Trend of Printed Wiring Board Market        (Mr. Ryo Koido - Yano Research Institute)        2) FPC Technology Trend and Future Prospects        (Dr. Masahiro Aoyagi - AIST)        3) Advanced Technology for PKG Substrate        (Dr. Chang Seop Ryu - SAMSUNG ELECTRO MECHANICS)