S16 Packaging Technology

CARL CHIANG, TPCA

  S17 Testing/Reliability 3

Chair: Tim Lee, KPCA

   S18 Soldering

Kevin Yan, CPCA

13:00~13:30

PKO-1 Strong Effect of Plating

Current Density on the Cu Pillar

Microstructure and Its Adhesion

with An ABF Substrate
YingSyuan Wu, Yuan Ze University

RLO-31 Evaluation of the Anti-Creep Corrosion Capacity for ENIG PCB by Way of Accelerated Corrosion Verification Platform
Dem Lee, IST

ST0-1 Solderability between

Sn-3Ag-0.5Cu Alloy and

Cu Pillars Deposited via Different Plating Current Densities
PeiTzu Lee, Yuan Ze University

13:30~14:00

PKO-2  Controlling the Adhesion of Electroless Plating Ni-P Film on Si Wafer by Silane Compound Modification and Rapid Thermal Annealing

Wei-Yen Wang, National Tsing Hua University

RLO-32 Flexibility Test Method for Optic-Electric FPCB

Young-Min Im, Korea Electronics Technology Institute

STO-2 Solder Wetting Behavior of Plasma Organic Surface Finish with Multiple Heat-Treatment
Kyoung-Ho Kim, Korea Institute of Industrial Technology

14:00~14:30

PKO-3 Study on A Formulated No Clean Flux For Fine-Pitch Flip Chip Package of Copper Pillar/

Microbump Interconnect
Ya-Ching Chuang, Shenmao Technology Inc.

STO-3 Interfacial Microstructures of Solder Joints on ENIG and ENEPIG Surface Finishes with Metal Turnover of Ni Plating Solution
Wonil Seo, Korea Institute of Industrial Technology