대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다
국내외PCB역사
World
- 2009
- Developmetn of ETS (ASE)
- 2007
- Development of Coreless Package (NEC)
- 1991
- Development of Build-up (IBM)
- 1989
- Development of P-BGA (IBM)
- 1969
- FPC production (Phioips)
- 1961
- Production of Multi-layer PCB (Hazeltine)
- 1950
- Development of Double-sided PCB (Motorola)
- 1940
- Production of single-sided PCB (IBM)
- 1936
- Develop of PCB (Pual Eisler)
Korea
- 2002
- Production of FC-BGA
- 1997
- Production of Build-up PCB Production of P-BGA
- 1982
- Production of Multi-layer PCB
- 1972
- Prodction of double-sided PCB
- 1963
- Production of Single-sided PCB