대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

국내외PCB역사

    World

    2023
    Intel’s Announcement on Glass Substrates Development
    2022
    H.R. 7677: Supporting American Printed Circuit Boards Act
    2020
    Roadmap for Apple’s 2030 Carbon Neutrality
    2018
    Hybrid Bonding
    2016
    SLP Production
    2015
    FOWLP Production
    2009
    Developmetn of ETS (ASE)
    2007
    Development of Coreless Package (NEC)
    1991
    Development of Build-up (IBM)
    1989
    Development of P-BGA (IBM)
    1969
    FPC production (Phioips)
    1961
    Production of Multi-layer PCB (Hazeltine)
    1950
    Development of Double-sided PCB (Motorola)
    1940
    Production of single-sided PCB (IBM)
    1936
    Develop of PCB (Pual Eisler)
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    Korea

    2020
    5G, Cloud AI, Autonomous driving, Advanced Semiconductor Packaging
    2017
    Production of SLP
    2009
    Production of FOWLP
    2002
    Production of FC-BGA
    1999
    Production of CSP
    1997
    Production of Build-up PCB Production of P-BGA
    1982
    Production of Multi-layer PCB
    1972
    Prodction of double-sided PCB
    1963
    Production of Double-sided PCB